These parameters should be appropriately determined to improve machining accuracy and efficiency. The basic principle of the machining process is illustrated in Figure 1.Figure 1.Basic Bortezomib material removal mechanism of powder blasting.4.?Experimental Methods4.1. Specimen PreparationThe process flow of the micro channel fabrication process using powder selleck inhibitor blasting is illustrated in Figure 2. The procedure can be described as follows.Figure 2.Patterning process by powder blasting.Micro pattern designFigure 3(a) shows the details of the designed micro patterns and micro channels; square and circular patterns are designed for biochip application. Two types of patterns are designed: 200��m channels (W=200��m, A=D=400��m and L=8mm) and 300��m channels (W=300��m, A=D=600��m and L=8 mm).

These patterns are used for the masking process.Figure Inhibitors,Modulators,Libraries 3.Designed pattern and masked specimen.Masking processThe purpose of the masking process is to prepare required specimens Inhibitors,Modulators,Libraries with micro patterns. A dry film is used for the masking process. Inhibitors,Modulators,Libraries The film thickness influences the resolution and accuracy of the machined shapes. UV hardening polyurethane is used as a film material to provide wear-resistance during the process. The details of the applied masking process are as follows:-Laminating: A film is adhered to the workpiece.-Exposure: A parallel UV beam is irradiated to make required patterns.-Developing: The specimen is developed using a developing solution, which is composed of distilled water and a 5% Na2CO3 solution.

Finally, required patterns can be obtained by removing the masks from the desired regions.

Figure 3(b) shows a photograph of a specimen after the masking process. Figure 4 shows measured 3-dimensional shapes and cross-sectional profiles of the masks formed on the glass. From the results, it is found that the measured width of the masked pattern Inhibitors,Modulators,Libraries Inhibitors,Modulators,Libraries is about 10��m larger than the Inhibitors,Modulators,Libraries designed value. This discrepancy is attributed Inhibitors,Modulators,Libraries to errors such as resolution Inhibitors,Modulators,Libraries difference, light dispersion in the exposure process, etc.Figure 4.3-dimensional shapes and Brefeldin_A cross-sectional profiles of masked patterns. (vertical scale=20��m, horizontal scale=50��m)Powder blasting processPowder blasting is performed on the machine.

Here, the regions from which the masks are removed in the developing process are selectively machined.Mask removing and cleaning processAfter the machining process is finished, any remaining mask adhering to the workpiece surface is removed, and the workpiece is cleaned using ultrasonic cleaning equipment.4.2. Abrasive ParticlesTwo Cilengitide types of abrasives, WA#600 and #1200, are used blog post for the micro powder blasting experiments. WA denotes white alundum, and its main ingredient is Al2O3. Figure 5 shows SEM micrographs of the employed abrasive Sorafenib Tosylate buy particles.Figure 5.