CH also conceived the RXDX-101 research buy study, participated in its design and coordination, and drafted the manuscript. BKK participated in measuring the electrical characteristics and their corresponding analysis. BJP performed the PL measurement. EHJ participated in measuring the EL spectra. SHK participated in measuring the optical properties. All authors read and approved the final manuscript.”
“Background Monocrystalline germanium is widely used in the fields of semiconductors, infrared optics, high-frequency electronics, and so on. Single-point diamond turning is usually adopted to achieve high RG7420 chemical structure surface finish and intricate features.

However, it is hard to obtain perfect optical quality and complex surfaces for monocrystalline germanium because of its brittle nature. Therefore, understanding the mechanism of nanometric cutting and machined surface characteristics is of great significance in manufacturing high quality germanium components. Since 1990s, Shimada et al. have conducted a series of investigations on the mechanism of nanometric cutting of single crystals by molecular dynamics (MD) simulation. They found dislocations generated during nanometric cutting of aluminum and copper [1, 2]. The A-1210477 cell line single crystal

silicon was removed in ductile mode when the depth of cut decreased to nanoscale, and amorphous silicon on machined surface was observed after nanometric cutting [3, 4]. Komanduri et al. studied the effect of crystal orientation on the nature of cutting deformation for copper and aluminum by molecular dynamics simulation Florfenicol [5–7]. They concluded that the phase transformation from a diamond cubic to β-Sn structure appeared in the case of nanometric cutting on silicon. Fang et al. proposed the extrusion model for cutting materials at nanometric scale, indicating that

the conventional cutting theory could no longer explain the mechanism of nanoscale cutting [8–11]. The process of nanocutting was affected by the tool-edge radius, and monocrystalline crystal silicon transformed into polycrystal and amorphous structure during and after nanocutting. Previous investigations indicate that the deformation mechanism of single crystal copper and aluminum during nanometric cutting is mainly the formation and extension of dislocations. However, silicon is removed in ductile mode; phase transformation and amorphization are the main deformations during nanometric cutting, observed by molecular dynamics simulation. At present, study on the nanometric cutting of germanium by molecular dynamics simulation has rarely been reported. In this paper, large-scale three-dimensional MD simulations are conducted to study the nanometric cutting of germanium. Attentions are focused on the material flow, cutting force and energy, crystal orientation effect, and surface-subsurface deformation. Methods MD simulation method Figure 1 shows the three-dimensional MD simulation model of nanometric cutting.